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HardwareAI / MLTech news / industry

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343 from 22 May 2020 to 23 Oct 2026
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2026 75

  1. Amazon’s Trainium Takes a Strike at the Training King
  2. The Huawei-DeepSeek Symbiosis
  3. Datacenters 2027: The Year of Acceleration, +50GW in a Single Year
  4. ASML Is Building a Hybrid Bonding Tool!
  5. Beijing Will Not Pace the Frontier: China’s Speed-First AI Safety Regime
  6. Anthropic Subscriptions Offer 5x+ More Value Than OpenAI
  7. How GLM5.3 Sparse Attention Affects HBM Memory Usage
  8. Intel Panther Lake Teardown
  9. The Chinese AI Infrastructure Boom: Introducing the SemiAnalysis China Datacenter Model
  10. ClusterMAX 3.0: The Industry Standard GPU Cloud Rating System Returns
  11. Computation and Data Movement for Inference
  12. Engrams Embedding Entendre: Codesign for Efficient DRAM/SSD Offloading
  13. Everyone Says Datacenter Moratoriums Are Killing the US Buildout. We disagree
  14. Vera Rubin NVL72 Agentic Inference: 67x better Performance per Dollar
  15. A Brain Too Big to Carry — On-Device vs Datacenter Inference
  16. Long Live the Short King: Why 4-hi HBM Wins
  17. Nvidia’s Backstop Universe – Heads I Win, Tails Who Loses?
  18. What is So Hard About Behind-The-Meter Power For Datacenters? Part 1
  19. TPU Inference Externalization Full Steam Ahead - InferenceX
  20. Korea’s Trillion-Dollar Sovereign AI Investment: Nvidia Wins, Hynix Loses
  21. Most Neoclouds Suck At Security
  22. OpenAI Jalapeño: Better Than Nvidia Blackwell
  23. AgentX - InferenceXv3: Does CUDA Moat Hold up in Agentic Inferencing?
  24. Are Open Models Catching Up?
  25. Cerebras's Next Generation CS-4: Fast Just Got Faster
  26. $12B of US ratepayers' money wasted on a modeling mistake and PJM wants to do it again
  27. Ultra-High Interactivity on NVIDIA GPUs? - TileRT InferenceX
  28. SpaceX 10GW in 2027 – Why It’s Real, Will Drive $300B ARR for SpaceX, and Why Microsoft Will Be the Largest Offtaker
  29. Gemini is Cooked but GCP is Cooking
  30. Kimi K3, The Manos, The Mythos, The Legendos
  31. The Wild Wild West Of LEGO Datacenters
  32. Can AMD break the CUDA Moat? AMD Advancing AI 2026
  33. Vera Rubin NVL72 vs GB200 NVL72? Inference TCO & Architecture Analysis
  34. Meta’s Infrastructure Team Needs A Culture Reset
  35. The Future of Meta Superintelligence: A 1 Year Progress Update
  36. Anthropic 3Q26 Profit Over $1B: The Anthropic IPO Financials Sneak Peak
  37. Nvidia GPU Debt Backstop Unleashes the AI Project Trinity: Capital, Offtake and Datacenters
  38. Meta Compute: Everyone Wants To Be A Neocloud
  39. EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More
  40. TokenBudgeting: Our Conversations with Enterprises on Token Spend
  41. US Grid Constraints: Towards 40GW+ of Behind-The-Meter Datacenter by 2028?
  42. China’s CXMT Is Set to Challenge DRAM Incumbents
  43. Stop Saying Half of 2026 US Datacenter Capacity Is Canceled
  44. RL Systems Mind the Gap: Matching Trainer and Generator Throughput
  45. Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
  46. Intel Should Raise Capital
  47. DeepSeekV4 1.6T Day 0 to Day 43 Performance Over Time - Huawei, GB300 NVL72, MI355X, B200
  48. Unitree's Impossible Trajectory Is Still Overlooked
  49. To Boldly Go: The Case for Space Datacenters
  50. AI Dark Output: The Visible Cost of Invisible Output
  51. Finding Miscompiles for Fun, Not Profit
  52. Anthropic Growth and Bedrock Mix Drive AWS Margins Higher While Peers Lag
  53. Inside the 800VDC Revolution – Part 1
  54. EDA Market Primer - Market Dynamics, Cadence, Synopsys, Siemens, China EDA Rise
  55. Cerebras — Faster Tokens Please
  56. The EDA Primer: From RTL to Silicon
  57. AI Value Capture - The Shift To Model Labs
  58. The Coding Assistant Breakdown: More Tokens Please
  59. How Much Do GPU Clusters Really Cost?
  60. ISSCC 2026: NVIDIA & Broadcom CPO, HBM4 & LPDDR6, TSMC Active LSI, Logic-Based SRAM, UCIe-S and More
  61. The Great GPU Shortage – Rental Capacity – Launching our H100 1 Year Rental Price Index
  62. Dissecting Nvidia Blackwell - Tensor Cores, PTX Instructions, SASS, Floorsweep, Yield
  63. Nvidia – The Inference Kingdom Expands
  64. The Great AI Silicon Shortage
  65. Are AI Datacenters Increasing Electric Bills for American Households?
  66. Vera Rubin – Extreme Co-Design: An Evolution from Grace Blackwell Oberon
  67. InferenceX v2: NVIDIA Blackwell Vs AMD vs Hopper - Formerly InferenceMAX
  68. CPUs are Back: The Datacenter CPU Landscape in 2026
  69. Memory Mania: How a Once-in-Four-Decades Shortage Is Fueling a Memory Boom
  70. Claude Code is the Inflection Point
  71. From Tokens to Burgers: A Water Footprint Face-Off
  72. Interconnects Beyond Copper, 1,000 CFETs, SK Hynix Next-Gen NAND, 2D Materials, and More
  73. Apple-TSMC: The Partnership That Built Modern Semiconductors
  74. RL Environments and RL for Science: Data Foundries and Multi-Agent Architectures
  75. Co-Packaged Optics (CPO) Book – Scaling with Light for the Next Wave of Interconnect

2025 42

  1. How AI Labs Are Solving the Power Crisis: The Onsite Gas Deep Dive
  2. AWS Trainium3 Deep Dive | A Potential Challenger Approaching
  3. TSMC Overseas Fabs – A Success?
  4. TPUv7: Google Takes a Swing at the King
  5. Microsoft's AI Strategy Deconstructed - From Energy to Tokens
  6. ClusterMAX™ 2.0: The Industry Standard GPU Cloud Rating System
  7. How to Kill 2 Monopolies with 1 Tool
  8. Nanoimprint Lithography: Stop Saying It Will Replace EUV
  9. Quadruped State of The Market - Unitree, Boston Dynamics, ANYbotics, DEEP Robotics, and The Rising Application Ecosystem
  10. InferenceMAX™: Open Source Inference Benchmarking
  11. xAI's Colossus 2 - First Gigawatt Datacenter In The World, Unique RL Methodology, Capital Raise
  12. Another Giant Leap: The Rubin CPX Specialized Accelerator & Rack
  13. Huawei Ascend Production Ramp: Die Banks, TSMC Continued Production, HBM is The Bottleneck
  14. Amazon’s AI Resurgence: AWS & Anthropic's Multi-Gigawatt Trainium Expansion
  15. H100 vs GB200 NVL72 Training Benchmarks - Power, TCO, and Reliability Analysis, Software Improvement Over Time
  16. GPT-5 Set the Stage for Ad Monetization and the SuperApp
  17. Scaling the Memory Wall: The Rise and Roadmap of HBM
  18. Robotics Levels of Autonomy
  19. Intel 18A Details & Cost, Future of DRAM 4F2 vs 3D, Backside Power Adoption (or Not), China's FlipFET, Digital Twins from Atoms to Fabs, and More
  20. Meta Superintelligence - Leadership Compute, Talent, and Data
  21. DeepSeek Debrief: >128 Days Later
  22. How Oracle Is Winning the AI Compute Market
  23. AI Training Load Fluctuations at Gigawatt-scale - Risk of Power Grid Blackout?
  24. NVIDIA Tensor Core Evolution: From Volta To Blackwell
  25. AMD Advancing AI: MI350X and MI400 UALoE72, MI500 UAL256
  26. The New AI Networks | Ultra Ethernet UEC | UALink vs Broadcom Scale Up Ethernet SUE
  27. Scaling Reinforcement Learning: Environments, Reward Hacking, Agents, Scaling Data
  28. AMD vs NVIDIA Inference Benchmark: Who Wins? - Performance & Cost Per Million Tokens
  29. AI Arrives In The Middle East: US Strikes A Deal with UAE and KSA
  30. Microsoft's Datacenter Freeze - 1.5GW Self-Build Slowdown & Lease Cancellation Misconceptions
  31. AMD 2.0 - New Sense of Urgency | MI450X Chance to Beat Nvidia | Nvidia's New Moat
  32. Huawei AI CloudMatrix 384 – China's Answer to Nvidia GB200 NVL72
  33. High-NA is Here (for R&D), EUV Cost, Pattern Shaping Gaining Share, 6x12" Mask, Metal Oxide & Dry Resist, Hyper-NA
  34. Tariff Armageddon? | GPU Loopholes, Mexico Supply Chain Shift, Wafer Fab Equipment Vulnerabilities, Optical Module Pricing Surge, Datacenter Equipment
  35. The GPU Cloud ClusterMAX™ Rating System | How to Rent GPUs
  36. NVIDIA GTC 2025 - Built For Reasoning, Vera Rubin, Kyber, CPO, Dynamo Inference, Jensen Math, Feynman
  37. America Is Missing The New Labor Economy - Robotics Part 1
  38. Datacenter Anatomy Part 2 – Cooling Systems
  39. TSMC N2 + Next-Gen SoIC, Intel EMIB-T, Meta 3D Stacked Memory, CFET, 2D Materials, and More
  40. DeepSeek Debates: Chinese Leadership On Cost, True Training Cost, Closed Model Margin Impacts
  41. OpenAI Stargate Joint Venture Demystified | Microsoft Sore Loser, Does Softbank Have The Capital?, Texas GigaCampus, Winners & Losers
  42. 2025 AI Diffusion Export Controls - Microsoft Regulatory Capture, Oracle Tears, Impacts Quantified, Model Restrictions

2024 30

  1. Nvidia's Christmas Present: GB300 & B300 - Reasoning Inference, Amazon, Memory, Supply Chain
  2. MI300X vs H100 vs H200 Benchmark Part 1: Training - CUDA Moat Still Alive
  3. Scaling Laws - O1 Pro Architecture, Reasoning Training Infrastructure, Orion and Claude 3.5 Opus “Failures”
  4. Intel on the Brink of Death | Culture Rot, Product Focus Flawed, Foundry Must Survive
  5. Amazon’s AI Self Sufficiency | Trainium2 Architecture & Networking
  6. Fab Whack-A-Mole: Chinese Companies are Evading U.S. Sanctions
  7. Datacenter Anatomy Part 1: Electrical Systems
  8. AI Neocloud Playbook and Anatomy
  9. Clash of the Foundries: Gate All Around + Backside Power at 2nm
  10. Multi-Datacenter Training: OpenAI's Ambitious Plan To Beat Google's Infrastructure
  11. The Memory Wall: Past, Present, and Future of DRAM
  12. Nvidia's Blackwell Reworked - Shipment Delays & GB200A Reworked Platforms
  13. GB200 Hardware Architecture - Component Supply Chain & BOM
  14. 100,000 H100 Clusters: Power, Network Topology, Ethernet vs InfiniBand, Reliability, Failures, Checkpointing
  15. OpenAI Chip Team Is Now Serious
  16. How Dell Is Beating Supermicro
  17. Apple’s AI Strategy: Apple Datacenters, On-device, Cloud, And More
  18. OpenAI Is Doomed? - Et tu, Microsoft?
  19. Intel’s 14A Magic Bullet: Directed Self-Assembly (DSA)
  20. Nvidia Blackwell Perf TCO Analysis - B100 vs B200 vs GB200NVL72
  21. Is Intel Back? Foundry & Product Resurgence Measured
  22. Nvidia’s Optical Boogeyman – NVL72, Infiniband Scale Out, 800G & 1.6T Ramp
  23. Nvidia B100, B200, GB200 - COGS, Pricing, Margins, Ramp - Oberon, Umbriel, Miranda
  24. Astera Labs IPO - The Next Connectivity Superhero or Steamrolled By Competition?
  25. CXL Is Dead In The AI Era
  26. AI Datacenter Energy Dilemma - Race for AI Datacenter Space
  27. Groq Inference Tokenomics: Speed, But At What Cost?
  28. Hybrid Bonding Process Flow - Advanced Packaging Part 5
  29. Neural Network Quantization & Number Formats From First Principles
  30. Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB - IEDM 2023

2023 61

  1. Inference Race To The Bottom - Make It Up On Volume?
  2. ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
  3. AMD MI300 Performance - Faster Than H100, But How Much?
  4. GPU Cloud Economics Explained – The Hidden Truth
  5. Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State
  6. Microsoft Infrastructure - AI & CPU Custom Silicon Maia 100, Athena, Cobalt 100
  7. Nvidia's New China AI Chips Circumvent US Restrictions | H20 Faster Than H100 | Huawei Ascend 910B
  8. AMD MI300 Ramp, GPT-4 Performance, ASP & Volumes
  9. Wafer Wars: Deciphering Latest Restrictions On AI And Semiconductor Manufacturing
  10. Going Vertical: Gate All Around, 3D DRAM, 3D NAND - Kokusai Electric IPO
  11. Nvidia’s Plans To Crush Competition – B100, “X100”, H200, 224G SerDes, OCS, CPO, PCIe 7.0, HBM3E
  12. AI Doomer vs Techno-Optimist: Social Fabric, AI Girlfriends, Mass Media
  13. Amazon Anthropic: Poison Pill or Empire Strikes Back
  14. Nvidia Buys Illumina? The AI Foundry for Healthcare – The Hardware of Life
  15. Arm and a Leg: Arm's Quest To Extract Their True Value
  16. China AI & Semiconductors Rise: US Sanctions Have Failed
  17. TPUv5e: The New Benchmark in Cost-Efficient Inference and Training for <200B Parameter Models
  18. Broadcom’s Google TPU Revenue Explosion, Networking Boom, VMWare Integration
  19. Google Gemini Eats The World – Gemini Smashes GPT-4 By 5X, The GPU-Poors
  20. Nvidia's Optical Ascent: >$1B Revenue; The Missing 800G Ramp; AI Head-Fakes
  21. Nvidia’s Ramp – Volume, ASP, Cloud Pricing, Margins, EPS, Cashflow, China, Competition
  22. Energizing AI: Power Delivery Competition Heats Up Vicor, MPS, Delta, ADI, Renesas, Infineon
  23. AI Expansion - Supply Chain Analysis For CoWoS And HBM
  24. NAND Flash Monopoly Broken? Tokyo Electron Moly Dep + Cryo Etch Takes On Lam Research For The Future Of NAND
  25. GPT-4 Architecture, Infrastructure, Training Dataset, Costs, Vision, MoE
  26. AI Capacity Constraints - CoWoS and HBM Supply Chain
  27. Tesla AI Capacity Expansion – H100, Dojo D1, D2, HW 4.0, X.AI, Cloud Service Provider
  28. Rebuilding Intel – Foundry vs IDM Decades of Inefficiencies Unraveled
  29. AMD MI300 – Taming The Hype – AI Performance, Volume Ramp, Customers, Cost, IO, Networking, Software
  30. Zen 4c: AMD’s Response to Hyperscale ARM & Intel Atom
  31. AI Server Cost Analysis – Memory Is The Biggest Loser
  32. Nvidia’s InfiniBand Problem - Spectrum-X AI Fabric, Tomahawk-5, Jericho-3AI, Quantum-2
  33. Meta Custom Silicon: What's Old Is New
  34. Sound The Siryn: AmpereOne 192-Core CPU
  35. On Device AI – Double-Edged Sword
  36. Meta’s Bizarre AI Infrastructure Choice Costs Them $100s of Millions
  37. Google "We Have No Moat, And Neither Does OpenAI"
  38. Intel Emerald Rapids Backtracks on Chiplets – Design, Performance & Cost
  39. TSMC’s Heroic Assumption – Low Utilization Rates, Fab Cancellation, 3nm Volumes, Automotive Weakness, AI Advanced Packaging Demands, 2024 Capex Weakness
  40. Google AI Infrastructure Supremacy: Systems Matter More Than Microarchitecture
  41. Silicon Carbide Game-Changer: Aehr's Edge - SiC Pure Play $AEHR
  42. Caught in the Crossfire: Short Target in the Looming US Tool Ban Saga
  43. Amazon’s Cloud Crisis: How AWS Will Lose The Future Of Computing
  44. Google OCS Apollo: The >$3 Billion Game-Changer in Datacenter Networking
  45. Marvell's DSP Dilemma? Networking’s Tectonic Shift Led By Broadcom, Nvidia, Arista Networks, Microsoft, Meta, Macom, and more
  46. EUV Requirements Halved? Applied Materials' Sculpta Redefines Lithography And Patterning Market
  47. Embracing Chaos: The Imperfect Art of Semiconductor Manufacturing And Lithography
  48. The Future of the Transistor
  49. Thick Cables, Thin Margins – Microsoft, Amazon, and Google Demand Overstated By $CRDO Credo
  50. Peeling The Onion’s Layers - Large Language Models Search Architecture And Cost
  51. The Inference Cost Of Search Disruption – Large Language Model Cost Analysis
  52. A Century of Moore’s Law
  53. TSMC 3nm FinFlex + Self-Aligned Contacts, Intel EMIB 3 + Foveros Direct, AMD Yield Issues, IBM Vertical Transport FET (VTFET) + RU Interconnects, CFET, Sequential Stacking, Samsung Yield, and more
  54. Intel Cuts Pay For Employees To Keep Their Quarterly Dividend
  55. The Gaps In The New China Lithography Restrictions – ASML, SMEE, Nikon, Canon, EUV, DUV, ArFi, ArF Dry, KrF, and Photoresist
  56. Semiconductor Bear Market Rally? – Inventory Analysis Of 71 Companies Over 25 Years
  57. The AI Brick Wall – A Practical Limit For Scaling Dense Transformer Models, and How GPT 4 Will Break Past It
  58. Separating Reality from Hype - Quantum Computing Explained
  59. How Nvidia’s CUDA Monopoly In Machine Learning Is Breaking - OpenAI Triton And PyTorch 2.0
  60. Intel Roadmap and PC TAM Update – Tone Deaf, Out Of Touch, Living In a Fantasy World, or Disconnected From Reality?
  61. TSMC Says They Will Sidestep The Recession – 2023 Outlook, Q4 2022 Earnings

2022 80

  1. India’s Semiconductor Scam: Indian Mining Tycoon and Pro-CCP Assembly Giant Swindle India’s Semi Subsidy Program
  2. Ventana RISC-V CPUs Beating Next Generation Intel Sapphire Rapids! – Overview of 13 RISC-V Companies, CPUs, and Ecosystem
  3. TSMC’s 3nm Conundrum, Does It Even Make Sense? – N3 & N3E Process Technology & Cost Detailed
  4. Fungible DPUs Are Dead – Acquired By Major US Cloud – Acquisition Details
  5. Marvell's Vision – Custom Silicon, CXL, DPUs, Ethernet, Optical, Telecom, Storage, Automotive, SerDes, 2025 Revenue & EPS
  6. Samsung Backstabs The DRAM Cartel – Capital Expenditure Cuts, 130 Manufacturing Projects, 60 Companies Report
  7. Marvell's Next $1B Business Is Security – Hardware Security Modules HSMs
  8. GPT Model Training Competition Heats Up - Nvidia Has A Legitimate Challenger
  9. Lithography Intensity And Long-Term Wafer Demand
  10. ASML & The Semiconductor Market In 2025 & 2030
  11. Q3 Earnings Ends With A Bang – $NVDA $MU $KLIC
  12. Arm’s Nuclear Option – Qualcomm Must Cancel Next-Generation Products If Arm Succeeds
  13. AMD Genoa Detailed – Architecture Makes Xeon Look Like A Dinosaur
  14. Q3 Semiconductor Roundup – $ENTG $AMD $CRUS $MPWR $POWI $ON $AMKR $ASX $GFS $QCOM $QRVO $SWKS $MKSI $ICHR $COHR $MXL $KLA $NVMI $ONTO
  15. The Future Of Military Sensing And Communications Systems – Co-Packaged Optics Enable Converged RF Phased Arrays
  16. The Future Of Packaging Gets Blurry – Fanouts, ABF, Organic Interposers, Embedded Bridges – Advanced Packaging Part 4
  17. Arm Changes Business Model – OEM Partners Must Directly License From Arm
  18. Q3 Semiconductor Roundup – $TXN $WOLF $ANET $NVDA $TER $UMC $GFS $HXSCL $INTC $STX $VECO $TPRO $ENTG $ASML $LRCX $AMAT $KLA $BESIY $SSNLF $ONTO
  19. Caliptra – First Open-Source Silicon Going Into All Datacenter Chips
  20. How China’s Biren Is Attempting To Evade US Sanctions
  21. 2023 Datacenter Outlook – AMD and Intel Revenue, ASP, and Units – Genoa Ramp Details
  22. Is Arm Desperate? Qualcomm Claps Back At Arm’s Potentially Frivolous Lawsuit
  23. China and USA Are Officially At Economic War – Technology Restriction Overview
  24. Amazon Web Services Infrastructure Inefficiencies Cause Cuts To Twitch Driving Creators To Google’s YouTube
  25. Semiconductor Fab Buildout Delays – 2023 to 2025 Wafer Fabrication Equipment Outlook
  26. Ada Lovelace GPUs Shows How Desperate Nvidia Is - AMD RDNA 3 Cost Comparison
  27. SiFive Powers Google TPU, NASA, Tenstorrent, Renesas, Microchip, And More
  28. Meta Discusses AI Hardware and Co-packaged Optics
  29. Is mmWave Adoption Stagnating? Qualcomm’s $6B Opportunity Update, $QCOM EPS Estimates
  30. How Onto Innovation Is Gaining Market Share From KLA - $ONTO $KLA
  31. Astera Labs Is First To CXL Memory Pooling Silicon – Beating Marvell, Rambus, Microchip, and Montage Technologies
  32. Austria’s Silent Monopolies On Advanced Semiconductor Manufacturing – EV Group and IMS Nanofabrication
  33. Beyond Advanced Packaging: Lightmatter Passage Chiplets Co-Packaged On Optical Interposer
  34. CXL Deep Dive – Future of Composable Server Architecture and Heterogeneous Compute, Products From 20 Firms, Overview of 3.0 Standard
  35. GlobalFoundries Stuffing Customers With High Inventory – Underweight $GFS
  36. 2022 NAND – Process Technology Comparison, China's YMTC Shipping Densest NAND, Chips 4 Alliance, Long-term Financial Outlook
  37. The History And Timeline Of Flash Memory
  38. Meet NETINT: The Startup Selling Datacenter VPUs To ByteDance, Baidu, Tencent, Alibaba, And More
  39. Intel Cuts Fab Buildout by $4B To Pay Billions In Dividends
  40. Lynceus: Inline, Real-time, AI Based Process Control Monitoring That Can Reduce Inspection & Metrology Capex
  41. The Dark Side Of The Semiconductor Design Renaissance – Fixed Costs Soaring Due To Photomask Sets, Verification, and Validation
  42. China’s SMIC Is Shipping 7nm Foundry ASICs
  43. DISCO Corporation, The World Leader In Semiconductor Capital Equipment For Cutting, Grinding, Polishing
  44. Lam Research Is Outsourcing More Than 1/3 Of Their Manufacturing To Malaysia
  45. ACM Research, China’s Most Successful Semiconductor Capital Equipment Provider, Wins At SK Hynix and Intel
  46. CXL Enables Microsoft Azure To Cut Server Capital Expenditures By Hundreds Of Millions Of Dollars
  47. Nvidia In The Hot Seat?
  48. Qualcomm RFFE Update – $8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF TAM
  49. Can You Trust Semiconductor Capital Equipment Firms? Supply Chain Or Technology…
  50. Die Size And Reticle Conundrum – Cost Model With Lithography Scanner Throughput
  51. AMD – To Infinity And Beyond
  52. Why America Will Lose Semiconductors
  53. Apple M2 Die Shot and Architecture Analysis – Big Cost Increase And A15 Based IP
  54. Packaging Developments From ECTC 2022
  55. Is Ampere Computing’s Cloud Native Marketing Fluff? – Siryn Ampere One 5nm Architecture, Cost Analysis, and IPO Analysis
  56. Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?
  57. Turning The Titanic – How Intel Is Using Software Acquisitions And Increased Accountability To Attempt To Save The Sinking Ship
  58. Marvell Acquires Tanzanite Silicon To Enable Composable Server Architectures Using CXL Based Memory Expansion And Pooling
  59. Ayar Labs | Co-packaged Optics Revolution | The Most Promising Hardware Startup With Wins At HPE And Nvidia?
  60. Samsung Electronics Cultural Issues Are Causing Disasters In Samsung Foundry, LSI, And Even DRAM Memory!
  61. Nvidia Ada Lovelace Leaked Specifications, Die Sizes, Architecture, Cost, And Performance Analysis
  62. Tenstorrent Blackhole, Grendel, And Buda - A Scale Out Architecture For Sparsity, Conditional Execution, And Dynamic Routing
  63. How Nvidia’s Empire Could Be Eroded - Intel Network And Edge Has The Playbook
  64. Short Report: Nvidia Supplier Cut Out Of Next Generation Hopper GPUs - Nvidia Represents Up To 55% of Revenue
  65. As Moore’s Law Slows, Apple Is Forced To Use Cheaper Chipsets In Non-Pro iPhones
  66. GlobalFoundries Fotonix, The Leading Silicon Photonics Foundry For Co-packaged Optics And Processing
  67. Graphcore Announces World’s First 3D Wafer On Wafer Hybrid Bond Processor
  68. Nvidia Hacked - A National Security Disaster
  69. I, Semiconductor – The Regionalization Of Semiconductors Due To Global Supply Chain Instability
  70. The Transformation of Veeco
  71. Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable?
  72. Semiconductor Roundup – 2/10/2022
  73. Semiconductor Roundup – 2/1/2022
  74. Is Intel Shipping Tools Out Of US Fabs So They Can Abuse CHIPS Act Subsidies?
  75. Semiconductor Roundup - 1/28/2022
  76. Semiconductor Roundup - 1/27/2022
  77. Advanced Packaging Part 3 – Intel’s Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape
  78. TSMC Throws Down a $40B-$44B Gauntlet, Far Surpassing Intel And Samsung
  79. Advanced Packaging Part 2 - Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia
  80. 2022 Semiconductor Outlook (and Webinar) - Transistor Radio Podcast Launch

2021 49

  1. TSMC Wants To Make Intel Dependent On External Manufacturing - Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm
  2. TSMC Wants To Make Intel Dependent On External Manufacturing - Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm
  3. Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets
  4. Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU
  5. Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market - CAR vs MOR vs Dry Resist
  6. Intel Betting The Farm – Shrinking Business, Margins Down For Few Years, But Aggressively Investing $40B-$43B A Year And More With Subsidies
  7. Qualcomm RFFE Business Continues Relentless Pace With ultraBAW Filters | >$8B Segment By 2025
  8. TSMC 3nm Wafer Shipments Pushed Into Q1 2023, 2.5 Years After N5 | TSMC 2nm, Samsung 2nm, And Intel 20A Battle It Out In 2025
  9. ASML’s EUV Tools Have A Throughput Problem, But Lyncean Has The Answer By Scaling EUV Light Source Power An Order Of Magnitude
  10. GlobalFoundries $GFS IPO – Mubadala Lost Over $22.4B, Now They Are Hoping Public Markets Bail Them Out
  11. China Has Built The World’s Most Expensive Silicon Carbide Fab, But Numbers Don’t Add Up
  12. Apple A15 Die Shot and Annotation - IP Block Area Analysis
  13. Aehr Multi-Wafer Level Burn-in Test for Silicon Carbide and Silicon Photonics Applications
  14. Memory Oligopoly Woes - Micron Says They Will Not Increase Wafer Output In DRAM Or NAND For The Foreseeable Future
  15. The Impending Chinese NAND Apocalypse – YMTC 128 Layer NAND Is The First Semiconductor Where China Is Technologically Competitive
  16. Kulicke & Soffa Industries, $KLIC, Continued Outperformance Of Wire Bonders And Emerging Supplier in Mini-LED, Micro-LED, And Battery Manufacturing
  17. Apple CPU Gains Grind To A Halt And The Future Looks Dim As The Impact From The CPU Engineer Exodus To Nuvia And Rivos Starts To Bleed In
  18. Will The China Real Estate Meltdown End The Semiconductor Shortage?
  19. Advanced Packaging The Size Of Your Monitor | Applied Materials, $AMAT, Modifies Panel PVD Tool For 60x60cm Fan Outs To Usher In A New Age Of Mega Packages
  20. No, The iPhone 13 Does Not Have Satellite Internet | Band n53 & Globalstar (GSAT) Explained
  21. NXP Semiconductor (NXPI) CFO Sells Nearly 70% Of His Shares As Samsung Acquisition Rumored To Fall Apart
  22. Rivos Inc | A Chip Off The Old Block? New RISC-V Startup Garners Many Senior CPU Architects From Apple, Google, Marvell, Qualcomm, Intel, and AMD
  23. A Chip Off The Old Block? New RISC-V Startup Garners Many Senior CPU Architects From Apple, Google, Marvell, Qualcomm, Intel, and AMD
  24. The Semiconductor Heist Of The Century | Arm China Has Gone Completely Rogue, Operating As An Independent Company With Inhouse IP/R&D
  25. The Tesla Dojo Chip Is Impressive, But There Are Some Major Technical Issues
  26. Tesla Dojo - Unique Packaging and Chip Design Allow An Order Magnitude Advantage Over Competing AI Hardware
  27. Kulicke & Soffa Industries, $KLIC, Crushes Earnings But Continues To Sandbag, $6 EPS '21, $6.75 EPS '22
  28. Tesla AI Day Supercomputer Chip Teaser | Is This The First Deployment Of TSMC InFO_SoW?
  29. Fears for Chinese Semiconductor Capital Equipment and Chemical Supply Chain Are Overblown | Cautionary Tale On Trusting Industry Analysts
  30. Power Integrations, $POWI, A Premier ESG Play Semiconductor Exposure To Electric Vehicles, Green Energy, And Power Efficiency Regulations
  31. Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chips
  32. MediaTek Officially Enters The Flagship Mobile Race With The First TSMC 4nm SOC
  33. Nvidia’s 2021 Bubble, Eerily Similar To Other Bubbles That Came Before
  34. Graphcore Looks Like A Complete Failure In Machine Learning Training Performance
  35. Micron Sells 3D X-Point Lehi, Utah Fab to Texas Instruments For $1.5B
  36. Cerebras Wafer Scale Hardware Crushes High Performance Computing Workloads Including Machine Learning And Beyond
  37. Samsung Foundry 3nm Gate All Around Process Node, 3GAE, Delayed To As Late As 2024
  38. Qualcomm MWC 2021 - Network Infrastructure And Edge 5G Get Supercharged | FSM200, DU X100 Accelerator, And Range Of Features
  39. Tenstorrent Wormhole Analysis - A Scale Out Architecture for Machine Learning That Could Put Nvidia On Their Back Foot
  40. Morgan Stanley Just Reduced TSMC’s Value By $25B While Demonstrating A Complete Lack of Semiconductor Knowledge
  41. Rockley Photonics Will Revolutionize Healthcare By Measuring Biomarkers Such As Glucose With Lasers In The Apple Watch
  42. GlobalFoundries Is A Leading-Edge Foundry Despite Claims Otherwise
  43. Qualcomm Hits a Homerun AI 100 - Powerful AI Inference Acceleration For the Edge
  44. Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0
  45. Google New Custom Silicon Replaces 10 Million Intel CPUs | Google Argos VPU
  46. Nvidia is Raking in the Money, but are Earnings Inflated?
  47. Semi Supply Chain Cutting Expectations as Phone Sales Plummet
  48. Trailing Edge is Going Gangbusters ($KLIC)
  49. Bridging the gap between business and the worlds most important industry.

2020 6

  1. Apple’s A14 Packs 134 Million Transistors/mm², but Falls Short of TSMC’s Density Claims
  2. Qualcomm Lost the iPhone 12 mmWave Antenna Module Contract to a Chinese Company
  3. Jensen Huang’s Vision For Data Center Dominance Will Destroy The Arm Ecosystem
  4. Mediatek Stands to Gain the Most from the New Cold War
  5. LAM Research (LRCX) Dry Deposit and Resist Could Become a Multi-Billion Dollar Business
  6. Moore’s Law is Dead for DRAM and that is Great for SemiCap